BGA-300

The BGA-300 Inspection Tools. These tools allow high magnification viewing underneath BGA and other SMT packages.

The compact, handheld systems are easy to carry through the factory or to different facilities.

The 2 mm prism and optional 1 mm prism allow inspection even on very densely populated boards.

Defect detected by the BGA 300 System

Cracked solder joint	Non-contact between ball and pad
Solder paste did not fully reflow	Broken solder joint